300 Systems
300 System Options
cs-325A
326
327
332
75x Systems
75x Systems Options
2001 Module
2001 Module Options
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CS-325 Termination Systems
- Automatic Termination & Drying System
-
with Paste Temperature Control
- Soft handling of parts with Debris
-
Separation and Precision Dipping.
- Small footprint, Low tooling cost &
-
Microprocessor controlled
- Chip Loading Smart Press
326 Termination Systems
- Automatic Termination & Drying System
-
with Paste Temperature Control
- Soft handling of parts with Debris
-
Separation and Precision Dipping.
- Low tooling cost & Microprocessor
-
controlled, Chip Loading Smart Press
327 Termination Systems
- Automatic Termination & Drying System
-
with Paste Temperature Control
- Soft handling of parts with Debris
-
Separation and Precision Dipping.
- Low tooling cost & Microprocessor
-
controlled, Chip Loading Smart Press
332 Termination Systems
in partnership with ESI
(Electro Scientific Industries Inc.)
For more specific information
click here
Chip
Termination
Contract
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Services
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